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This is our Verifier Pro x-ray inspection machine, we actually can look at bond termination components. We have a magnification of 900x, 40ip resolution. So we have enough resolution where we can actually zoom in and see bonding inside inside our ICs. We are actually mostly looking for the solder joints that are on the bottom. This picture here is just a caliber that we set for point one eight millimeters just to give you the idea of what the magnification looks like.
